Metallization by plating for high-performance multichip modules.
Keith K. H. WongSuryanarayana KajaPatrick W. DeHavenPublished in: IBM J. Res. Dev. (1998)
Keyphrases
- high reliability
- building blocks
- scientific computing
- functional modules
- modular structure
- cost effective
- data sets
- databases
- data mining
- machine learning
- software modules
- low cost
- multi agent systems
- modular architecture
- multiresolution
- evolutionary algorithm
- artificial neural networks
- database
- objective function
- multiscale
- e learning
- computer vision
- artificial intelligence
- information retrieval
- real time