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Design, fabrication and characterization of a single-chip three-dimensional electric field microsensor.

Biyun LingYu WangChunrong PengBing LiZhaozhi ChuBin LiShanhong Xia
Published in: NEMS (2017)
Keyphrases
  • single chip
  • three dimensional
  • software implementation
  • low power
  • low cost
  • electric field
  • high speed
  • cmos image sensor
  • image quality
  • multiscale
  • d objects