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Optimization of the thermal reliability of a four-tier die-stacked SiP structure using finite element analysis and the Taguchi method.
Yu Tang
Shaoming Luo
G. Y. Li
Z. Yang
Rui Chen
Y. Han
Chaojun Hou
Published in:
Microelectron. J. (2018)
Keyphrases
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finite element analysis
finite element
computer aided design
finite element model
optimization algorithm
global optimization
artificial intelligence
optimization problems
infrared
optimization method
reverse engineering
using artificial neural networks
material properties
temperature field