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Effect of aluminum concentration on the microstructure and mechanical properties of Sn-Cu-Al solder alloy.

Li YangYaocheng ZhangChengchao DuJun DaiNing Zhang
Published in: Microelectron. Reliab. (2015)
Keyphrases
  • mechanical properties
  • composite materials
  • stainless steel
  • finite element model
  • thin film
  • image segmentation
  • three dimensional
  • experimental data
  • motion tracking
  • material properties