A novel methodology for power delivery network optimization in 3-D ICs using through-silicon-via technology.
Bongki LeeByung-Gyu AhnJaehwan KimMinbeom KimJong-Wha ChongPublished in: ISCAS (2012)
Keyphrases
- campus network
- power consumption
- network structure
- global optimization
- optimization algorithm
- computer networks
- cost effective
- data processing
- complex networks
- silicon on insulator
- video delivery
- network infrastructure
- communication networks
- optimization problems
- network traffic
- personal computer
- network model
- network architecture
- distribution network
- x ray
- cmos technology
- social networks
- neural network