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Benchmarking Dynamic Three-Dimensional Bin Packing Problems Using Discrete-Event Simulation.
Ran Wang
Trung Thanh Nguyen
Shayan Kavakeb
Zaili Yang
Changhe Li
Published in:
EvoApplications (2) (2016)
Keyphrases
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discrete event simulation
packing problem
three dimensional
bin packing
cutting stock
discrete event
supply chain
semiconductor manufacturing
expert systems
complex systems
shape analysis