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Benchmarking Dynamic Three-Dimensional Bin Packing Problems Using Discrete-Event Simulation.

Ran WangTrung Thanh NguyenShayan KavakebZaili YangChanghe Li
Published in: EvoApplications (2) (2016)
Keyphrases
  • discrete event simulation
  • packing problem
  • three dimensional
  • bin packing
  • cutting stock
  • discrete event
  • supply chain
  • semiconductor manufacturing
  • expert systems
  • complex systems
  • shape analysis