BEOL Interconnect Innovation: Materials, Process and Systems Co-optimization for 3nm Node and Beyond.

Gaurav Thareja Ashish Pal Xingye Wang Sefa Dag Shi You Shashank Sharma Qing Zhu Carmen L. Cervantes Shinjae Hwang Matthew Spuller Ben Ng Pradeep S. Kumar Norman Tam Max Gage Sameer Deshpande Zhiyuan Wu Alexander Jansen Liton Dey Feng Chen Xianjin Xie Keyvan Kashefizadeh Vinod Reddy Andy Lo Zhebo Chen Sidney Huey Jianshe Tang He Ren Mehul Naik Brian Brown Sree Kesapragada Buvna Ayyagari-Sangamalli El Mehdi Bazizi Xianmin Tang

Published in: VLSI Technology and Circuits (2023)

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