A 3D heterogeneous integration method using LTCC wafer for RF applications.

Xiaoyu Mi Osamu Toyoda Satoshi Ueda Fumihiko Nakazawa

Published in: 3DIC (2011)

Keyphrases

high resolution
high accuracy
similarity measure
mathematical model
significant improvement
main contribution
synthetic data
preprocessing
cost function
input image
high precision
detection method
computationally efficient
mutual information
neural network
objective function
multiscale
information retrieval