Cool System scalable 3-D stacked heterogeneous Multi-Core / Multi-Chip architecture for ultra low-power digital TV applications.
Yukoh MatsumotoTomoyuki MorimotoMichiya HagimotoHiroyuki UchidaNobuyuki HikichiFumito ImuraHiroshi NakagawaMasahiro AoyagiPublished in: COOL Chips (2012)