Resonant pressure sensor with through-glass electrical interconnect based on SOI wafer technology.

Zhenyu Luo Deyong Chen Junbo Wang

Published in: NEMS (2014)

Keyphrases

case study
cost effective
sensor data
high speed
data processing
sensor technology
real time
sensor networks
rapid development
integrated circuit
wireless sensor
computer systems
parallel computing
massively parallel
semiconductor manufacturing