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Validation of the porous-medium approach to model interlayer-cooled 3D-chip stacks.
Thomas Brunschwiler
Stephan Paredes
Ute Drechsler
Bruno Michel
W. Cesar
G. Töral
Yuksel Temiz
Yusuf Leblebici
Published in:
3DIC (2009)
Keyphrases
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probabilistic model
high speed
computer vision
image sequences
multiscale
image compression