• search
    search
  • reviewers
    reviewers
  • feeds
    feeds
  • assignments
    assignments
  • settings
  • logout

TSV Based Orthogonal Coils With High Misalignment Tolerance for Inductive Power Transfer in Biomedical Implants.

Libo QianKefang QianYong ShiHuakang XiaJian WangYinshui Xia
Published in: IEEE Trans. Circuits Syst. II Express Briefs (2021)
Keyphrases