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Thermal uniformity of packaging multiple light-emitting diodes embedded in aluminum-core printed circuit boards.

Xingming LongRui-Jin LiaoJing ZhouZhi Zeng
Published in: Microelectron. Reliab. (2013)
Keyphrases
  • printed circuit boards
  • light emitting diodes
  • high speed
  • real time
  • image processing
  • multimedia
  • d scene