Login / Signup
Thermal uniformity of packaging multiple light-emitting diodes embedded in aluminum-core printed circuit boards.
Xingming Long
Rui-Jin Liao
Jing Zhou
Zhi Zeng
Published in:
Microelectron. Reliab. (2013)
Keyphrases
</>
printed circuit boards
light emitting diodes
high speed
real time
image processing
multimedia
d scene