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Analytical modeling and numerical simulations of temperature field in TSV-based 3D ICs.

Yuriy ShiyanovskiiChristos A. PapachristouCheng-Wen Wu
Published in: ISQED (2013)
Keyphrases
  • numerical simulations
  • temperature field
  • theoretical analysis
  • computational fluid dynamics
  • finite element method
  • heat transfer