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Study of dielectric material property impact on insertion loss for advanced packaging solutions.

Bok Eng CheahH. Louis LoJackson Kong
Published in: ICCE-TW (2015)
Keyphrases
  • machine learning
  • empirical studies
  • potential impact
  • neural network
  • real world
  • social networks
  • information technology
  • solution space
  • positive effects
  • interaction effects