Low-power and high-throughput hardware design for the 3D-HEVC depth intra skip.
Vladimir AfonsoAltamiro Amadeu SusinLuan AudibertMário SaldanhaRuhan A. ConceiçãoMarcelo Schiavon PortoBruno ZattLuciano Volcan AgostiniPublished in: ISCAS (2017)
Keyphrases
- high throughput
- low power
- hardware design
- low cost
- high speed
- power consumption
- microarray
- data acquisition
- genome wide
- hardware implementation
- biological data
- single chip
- depth information
- low power consumption
- proteomic data
- mass spectrometry
- mass spectrometry data
- power dissipation
- depth map
- logic circuits
- ultra low power
- mixed signal
- real time
- field programmable gate array
- gene expression
- general purpose
- pattern recognition