Improving FPGA Design with Monolithic 3D Integration Using High Dense Inter-Stack Via.
Srivatsa Rangachar SrinivasaKarthik MohanWei-Hao ChenKuo-Hsinag HsuXueqing LiMeng-Fan ChangSumeet Kumar GuptaJohn SampsonVijaykrishnan NarayananPublished in: ISVLSI (2017)