Login / Signup

A novel decapsulation technique for failure analysis of epoxy molded IC packages with Cu wire bonds.

Chien-Pan LiuYen-Fu LiuChang-Hung LiHung-Chieh ChengYi-Chun KungJeng-Yu Lin
Published in: Microelectron. Reliab. (2012)
Keyphrases
  • real world
  • quantitative analysis
  • automatic analysis
  • website
  • data analysis
  • machine learning
  • learning algorithm
  • wide range
  • digital libraries
  • relational databases
  • control system
  • software packages