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Fabrication of Multi-Scale Triangular Patch High Impedance Ground Planes to Improve the Bandwidth of Conformal Bow-Tie Antennas for Remote Sensing.

Bora CakirogluPeter J. CollinsMichael J. HavrillaKubilay SertelAndrew J. Terzuoli
Published in: IGARSS (4) (2008)
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