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Adaptive Hybrid Framework for Multiscale Void Inspection of Chip Resistor Solder Joints.

Pan XiaoMeng XiaoNian CaiBaojun QiuShuai ZhouHan Wang
Published in: IEEE Trans. Instrum. Meas. (2023)
Keyphrases
  • multiscale
  • low cost
  • high speed
  • real time
  • main contribution
  • data sets
  • neural network
  • theoretical framework
  • conceptual framework