A TDR-Based Method for Pre-bond Testing of the Silicon Interposer in 2.5D ICs.
Libao DengNing SunNing FuLiyan QiaoPublished in: I2MTC (2019)
Keyphrases
- high accuracy
- high precision
- significant improvement
- experimental evaluation
- synthetic data
- pairwise
- main contribution
- evaluation method
- theoretical analysis
- feature set
- high speed
- preprocessing
- classification accuracy
- probabilistic model
- maximum likelihood
- computational cost
- dynamic programming
- error rate
- cost function
- image sequences