3D stackable cryogenic InGaAs HEMTs for heterogeneous and monolithic 3D integrated highly scalable quantum computing systems.
Jaeyong JeongSeong Kwang KimJongmin KimDae-Myeong GeumJisung LeeSeung-Young ParkSanghyeon KimPublished in: VLSI Technology and Circuits (2022)
Keyphrases
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