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Wafer-level-packaged HARPSS+ MEMS platform: Integration of robust timing and inertial measurement units (TIMU) on a single chip.
Haoran Wen
Anosh Daruwalla
Yaesuk Jeong
Pranav Gupta
Jaehoo Choi
Chang-Shun Liu
Farrokh Ayazi
Published in:
PLANS (2018)
Keyphrases
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single chip
low cost
low power
fully integrated
real time
highly parallel
multi view
image processing
image analysis
stereo matching
digital camera