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Wafer-level-packaged HARPSS+ MEMS platform: Integration of robust timing and inertial measurement units (TIMU) on a single chip.

Haoran WenAnosh DaruwallaYaesuk JeongPranav GuptaJaehoo ChoiChang-Shun LiuFarrokh Ayazi
Published in: PLANS (2018)
Keyphrases
  • single chip
  • low cost
  • low power
  • fully integrated
  • real time
  • highly parallel
  • multi view
  • image processing
  • image analysis
  • stereo matching
  • digital camera