Creep lifetime prediction of solder joint for heat sink assembly.

Changwoon Han Chulmin Oh Nochang Park Wonsik Hong

Published in: Microelectron. Reliab. (2010)

Keyphrases

prediction accuracy
printed circuit boards
prediction model
residual energy
predicted values
prediction error
prediction algorithm
database
real time
assembly systems
neural network
genetic algorithm
video sequences
energy consumption
predictive model