Memory-efficient logic layer communication platform for 3D-stacked memory-on-processor architectures.
Masoud DaneshtalabMasoumeh EbrahimiPasi LiljebergJuha PlosilaHannu TenhunenPublished in: 3DIC (2011)
Keyphrases
- memory efficient
- multithreading
- external memory
- multi core processors
- memory management
- random access memory
- memory hierarchy
- memory access
- communication protocol
- single instruction multiple data
- iterative deepening
- multicore processors
- computing power
- intel xeon
- real time embedded
- multiple sequence alignment
- modal logic
- logic programming
- communication networks
- main memory
- memory subsystem
- real time
- processing elements
- state information
- memory space
- parallel processing
- multiprocessor systems
- chip design
- operating system
- high speed