Login / Signup

A Flip-Chip-Packaged 25.3 dBm Class-D Outphasing Power Amplifier in 32 nm CMOS for WLAN Application.

Hongtao XuYorgos PalaskasAshoke RaviMasoud SajadiehMohammed A. El-TananiKrishnamurthy Soumyanath
Published in: IEEE J. Solid State Circuits (2011)
Keyphrases
  • power consumption
  • high speed
  • low cost
  • low power
  • chip design
  • cmos technology
  • silicon on insulator
  • analog vlsi
  • nm technology
  • ultra low power
  • high power
  • ibm power processor