Reliability evaluation of ultra-thin CSP using new flip-chip bonding technology--double-sided CSP and single-sided CSP.
Kazuto NishidaKazumichi ShimizuMichiro YoshinoHideo KoguchiNipon TaweejunPublished in: Microelectron. Reliab. (2003)
Keyphrases
- constraint satisfaction problems
- constraint satisfaction
- arc consistency
- decomposition methods
- tree decompositions
- constraint programming
- constraint propagation
- high speed
- search space
- cost effective
- np complete
- constraint solving
- tree decomposition
- constraint problems
- constraint graph
- arc consistency algorithm
- evaluation method
- rapid development
- information retrieval
- constraint networks
- solving constraint satisfaction problems
- information systems