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Stability of the warpage in a PBGA package subjected to hygro-thermal loading.
Chi-Hui Chien
Thaiping Chen
Yung-Chang Chen
Yii-Tay Chiou
Chi-Chang Hsieh
Yii-Der Wu
Published in:
Microelectron. Reliab. (2006)
Keyphrases
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thermal imaging
thermal conductivity