Novel via Chain Structure for Failure Analysis at 65 nm-Node Fixing OPC Using Inner and Outer via Chain Dummy Patterns.
Takashi NasunoYoshihisa MatsubaraHiromasa KobayashiAkiyuki MinamiEiichi SodaHiroshi TsudaKoichiro TsujitaWataru WakamiyaNobuyoshi KobayashiPublished in: IEICE Trans. Electron. (2005)