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Soft-pad grinding of 300 mm wire-sawn silicon wafers: finite element analysis with designed experiments.
Jian (Jessie) Wu
Xuekun Sun
Z. J. Pei
X. Jack Xin
Kelli Simmelink
Published in:
Int. J. Manuf. Technol. Manag. (2008)
Keyphrases
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finite element analysis
finite element
computer aided design
using artificial neural networks
finite element model
semiconductor manufacturing
friction coefficient
database
databases
genetic algorithm
artificial intelligence
pattern recognition
cost function