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An investigation of reliability of solder joints in microelectronic packages by high temperature moiré method.
Haixia Shang
Jianxin Gao
Pascual Ian Nicholson
Steve Kenny
Published in:
Microelectron. Reliab. (2011)
Keyphrases
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pairwise
experimental evaluation
computational cost
preprocessing
cost function
high accuracy
clustering method
theoretical analysis
support vector machine svm
significant improvement
support vector machine
feature set
computationally efficient
detection method
synthetic data
fully automatic