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Analysis and In-Situ Measurement of Thermal-Mechanical Strain in Active Silicon Power Semiconductors.

Matthew L. SpencerRobert D. Lorenz
Published in: IAS (2008)
Keyphrases
  • statistical analysis
  • real time
  • image analysis
  • data sets
  • case study
  • high resolution
  • mobile robot
  • infrared
  • steady state
  • data acquisition
  • quantitative analysis
  • finite element analysis