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Effect of voids on the reliability of BGA/CSP solder joints.

Mohammad YunusK. SrihariJames M. PitarresiAnthony Primavera
Published in: Microelectron. Reliab. (2003)
Keyphrases
  • constraint satisfaction problems
  • decision trees
  • constraint satisfaction
  • constraint programming
  • arc consistency algorithm
  • real time
  • data sets
  • similarity measure
  • decomposition methods