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FSI implications of EMC rheological properties to 3D IC with TSV structures during plastic encapsulation process.

Ernest E. S. OngM. Z. AbdullahW. K. LohC. K. OoiR. Chan
Published in: Microelectron. Reliab. (2013)
Keyphrases
  • bayesian networks
  • desirable properties
  • database
  • databases
  • neural network
  • information retrieval
  • multi agent
  • data structure
  • artificial neural networks
  • integrated circuit