The need for a full-chip and package thermal model for thermally optimized IC designs.

Wei Huang Eric Humenay Kevin Skadron Mircea R. Stan

Published in: ISLPED (2005)

Keyphrases

computational model
theoretical analysis
objective function
probabilistic model
formal model
infrared
mathematical model
statistical model
case study
high level
video sequences
theoretical framework
experimental data
prediction model
autoregressive