Login / Signup
Design of a novel chip on glass package solution for CMOS image sensor device.
Ching-Yang Chen
Yung-Ching Chao
De-Shin Liu
Zhen-Wei Zhuang
Published in:
Microelectron. Reliab. (2006)
Keyphrases
</>
cmos image sensor
single chip
parallel processing
low power consumption
low cost
design process
solid state
cmos technology
design methodology
processing capabilities