Advanced BEOL Materials, Processes, and Integration to Reduce Line Resistance of Damascene Cu, Co, and Subtractive Ru Interconnects.
Takeshi NogamiOleg GluschenkovYasir SulehriaSon NguyenBrown PeethalaHuai HuangHosadurga ShobhaNick LanzilloRaghuveer PatlollaDevika SilAndrew SimonDaniel EdelsteinNelson FelixJunjun LiuToshiyuki TabataFulvio MazzamutoSebastien HaltyFabien RozéYasutoshi OkunoAkira UedonoPublished in: VLSI Technology and Circuits (2022)