The Research on Non-destructive Testing Method of Sheet Resistance in Micro Area of Silicon Wafer Based on EIT Technology.
Xinfu LiuJinhe LiuZhanping DuQuanming ZhaoJunying ZhaoYuhui HuangPublished in: IIH-MSP (2008)
Keyphrases
- high accuracy
- detection method
- high precision
- computationally efficient
- segmentation method
- experimental evaluation
- similarity measure
- fully automatic
- detection algorithm
- computational cost
- significant improvement
- prior knowledge
- preprocessing
- objective function
- case study
- cost function
- high speed
- support vector machine svm
- optimization algorithm
- computational complexity
- massively parallel