Login / Signup

Growth of tin whiskers for lead-free plated leadframe packages in high humid environments and during thermal cycling.

Yoshikuni NakadairaSeyoung JeongJongbo ShimJaiseok SeoSunhee MinTaeje ChoSayoon KangSeyong Oh
Published in: Microelectron. Reliab. (2008)
Keyphrases
  • solder ball connect
  • wide range
  • infrared
  • simplex method
  • printed circuit boards
  • data mining
  • dynamic environments
  • data sets
  • machine learning
  • knowledge base
  • power system
  • complex environments
  • high levels
  • small size