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A Novel Method Based on Deep Convolutional Neural Networks for Wafer Semiconductor Surface Defect Inspection.
Guojun Wen
Zhijun Gao
Qi Cai
Yudan Wang
Shuang Mei
Published in:
IEEE Trans. Instrum. Meas. (2020)
Keyphrases
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preprocessing
significant improvement
dynamic programming
high accuracy
detection method
pairwise
cost function
neural network
feature extraction
objective function
video sequences
support vector machine
d objects
segmentation algorithm