Login / Signup

Material improvement for ultrathin-wafer handling in TSV creation and PECVD process.

Amadine JouveWenbin HongD. BlumenshineJoElle DachsteinerRama PuligaddaDongshun BaiJ. DiazDavid Henry
Published in: 3DIC (2009)
Keyphrases
  • real world
  • artificial intelligence
  • computer vision
  • database
  • neural network
  • information systems
  • case study
  • digital libraries
  • expert systems
  • control system
  • mobile robot
  • software development