A novel dimension reduction technique for the capacitance extraction of 3D VLSI interconnects.
Wei Hong IIWeikai SunZhenhai ZhuHao JiBen SongWayne Wei-Ming DaiPublished in: ICCAD (1996)
Keyphrases
- dimension reduction
- power dissipation
- high speed
- principal component analysis
- power consumption
- feature extraction
- high dimensional problems
- high dimensional
- data mining and machine learning
- variable selection
- low dimensional
- low power
- dimensionality reduction
- random projections
- partial least squares
- singular value decomposition
- high dimensional data
- information extraction
- manifold learning
- high dimensional data analysis
- high dimensionality
- linear discriminant analysis
- cluster analysis
- unsupervised learning
- feature space
- discriminative information
- feature selection
- data sets
- decision trees
- digital signal processing
- dimension reduction methods
- signal processing
- active learning
- machine learning