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Characterization of materials and their interfaces in a direct bonded copper substrate for power electronics applications.

A. Ben KabaarCyril ButtayO. DezellusR. EstevezAnthony GravouilLaurent Gremillard
Published in: Microelectron. Reliab. (2017)
Keyphrases
  • power electronics
  • magnetic recording
  • semiconductor devices
  • computer simulation
  • single phase
  • neural network
  • control system
  • thin film
  • power supply