Xing-Chang Wei

Publication Activity (10 Years)

Years Active: 2019-2024
Publications (10 Years): 5

Top Topics

High Spatial Resolution

Top Venues

IEEE Trans. Instrum. Meas.

Sci. China Inf. Sci.

IEEE Trans. Circuits Syst. II Express Briefs

Publications

Yu-Ru Feng, Xing-Chang Wei, Ling Zhang, Ze-Kai Hu, Si-Yao Tang, Richard Xian-Ke Gao
An Advanced Broadband Absorptive Balun for Modern Communication Systems. IEEE Trans. Circuits Syst. II Express Briefs 71 (8) (2024)
Yu Tian, Xing-Chang Wei, Di Wang, Richard Xian-Ke Gao
A Miniature Electric Probe With a High Spatial Resolution. IEEE Trans. Instrum. Meas. 73 (2024)
Bo-Wen Liu, Xing-Chang Wei, Chong-Xin Xv
A Hybrid De-Embedding Method for Low Loss and Reciprocal PCB Fixtures. IEEE Trans. Instrum. Meas. 71 (2022)
Da Yi, Ming-Chun Tang, Mei Li, Xing-Chang Wei
Efficient coupling of evanescent waves in rectangular waveguides based on ultrathin planar capacitive metasurfaces. Sci. China Inf. Sci. 64 (8) (2021)
Rui Yang, Xing-Chang Wei, Yu-Fei Shu, Yan-Bin Yang
A High-Frequency and High Spatial Resolution Probe Design for EMI Prediction. IEEE Trans. Instrum. Meas. 68 (8) (2019)