W. Y. Choo

Publication Activity (10 Years)

Years Active: 2016-2016
Publications (10 Years): 1

Top Topics

Management System

Top Venues

Publications

S. E. Kucuk Eroglu, W. Y. Choo, Yusuf Leblebici
Copper TSV-based die-level via-last 3D integration process with parylene-C adhesive bonding technique. 3DIC (2016)