Tim Claeys

Publication Activity (10 Years)

Years Active: 2020-2024
Publications (10 Years): 9

Top Topics

Selection Algorithm

Automatic Assessment

Top Venues

IEEE Trans. Instrum. Meas.

IEEE Internet Things J.

Publications

Bozheng Pang, Tim Claeys, Hans Hallez, Jeroen Boydens
Modeling the Trade-off between Throughput and Reliability in a Bluetooth Low Energy Connection. CoRR (2024)
Bozheng Pang, Tim Claeys, Kristof T'Jonck, Jens Vankeirsbilck, Hans Hallez, Jeroen Boydens
Simulation for Trade-off between Interference and Performance in a Bluetooth Low Energy Network. TrustCom (2023)
Bozheng Pang, Tim Claeys, Jens Vankeirsbilck, Kristof T'Jonck, Hans Hallez, Jeroen Boydens
A Novel Model to Quantify the Impact of Transmission Parameters on the Coexistence Between Bluetooth Low Energy Pairs. IEEE Internet Things J. 10 (2) (2023)
Bozheng Pang, Tim Claeys, Hans Hallez, Jeroen Boydens
Modeling the Trade-off between Throughput and Reliability in a Bluetooth Low Energy Connection. EWSN (2023)
Hasan Habib, Tim Claeys, Guy A. E. Vandenbosch, Davy Pissoort
Evaluation of the A&S and the Advanced EMI Detectors Based on Modeling Frameworks With Appropriate Condition Assessment. IEEE Access 11 (2023)
Hao Liu, Tim Claeys, Davy Pissoort, Guy A. E. Vandenbosch
Long-Term Prediction of Multistress Accelerated Aging of Capacitors by Long Short-Term Memory Network. IEEE Trans. Instrum. Meas. 72 (2023)
Qazi Mashaal Khan, Lokesh Devaraj, Richard Perdriau, Alastair R. Ruddle, Tim Claeys, Mohamed Ramdani, Mohsen Koohestani
Experimental Characterization of Multitone EM Immunity of Integrated Oscillators Under Thermal Stress. IEEE Access 10 (2022)
Bozheng Pang, Kristof T'Jonck, Tim Claeys, Davy Pissoort, Hans Hallez, Jeroen Boydens
Bluetooth Low Energy Interference Awareness Scheme and Improved Channel Selection Algorithm for Connection Robustness. Sensors 21 (7) (2021)
Hao Liu, Tim Claeys, Davy Pissoort, Guy A. E. Vandenbosch
Prediction of Capacitor's Accelerated Aging Based on Advanced Measurements and Deep Neural Network Techniques. IEEE Trans. Instrum. Meas. 69 (11) (2020)