Shigeru Sawada

Publication Activity (10 Years)

Years Active: 2008-2017
Publications (10 Years): 1

Top Topics

Printed Circuit Boards

Deformation Field

Top Venues

IEICE Trans. Electron.

Publications

Shigeru Sawada, Song-Zhu Kure-Chu, Rie Nakagawa, Toru Ogasawara, Hitoshi Yashiro, Yasushi Saitoh
Effect of Hardness on Wear and Abrasion Resistance of Silver Plating on Copper Alloy. IEICE Trans. Electron. (9) (2017)
Terutaka Tamai, Shigeru Sawada, Yasuhiro Hattori
Deformation of Crystal Morphology in Tin Plated Contact Layer Caused by Loading. IEICE Trans. Electron. (9) (2012)
Terutaka Tamai, Shigeru Sawada, Yasuhiro Hattori
Contact Mechanisms and Contact Resistance Characteristics of Solid Tin and Plated Tin Contacts Used for Connectors. IEICE Trans. Electron. (5) (2010)
Shigeru Sawada, Terutaka Tamai, Yasuhiro Hattori, Kazuo Iida
Numerical Analyses for Contact Resistance due to Constriction Effect of Current Flowing through Multi-Spot Construction. IEICE Trans. Electron. (6) (2010)
Shigeru Sawada, Kaori Shimizu, Yasuhiro Hattori, Terutaka Tamai
Constriction Resistance Behavior of a Tin or Silver Plated Layer for an Electrical Contact. IEICE Trans. Electron. (4) (2010)
Hirosaka Ikeda, Tetsuya Ito, Shigeru Sawada, Yasuhiro Hattori, Yasushi Saitoh, Terutaka Tamai, Kazuo Iida
Influence of Fretting Wear on Lifetime of Tin Plated Connectors. IEICE Trans. Electron. (9) (2009)
Kaori Shimizu, Shigeki Shimada, Shigeru Sawada, Yasuhiro Hattori
Contact Area Analysis by FEM with Plating Layer for Electrical Contact. IEICE Trans. Electron. (8) (2009)
Tetsuya Ito, Shigeru Sawada, Yasuhiro Hattori, Yasushi Saitoh, Terutaka Tamai, Kazuo Iida
Micro-Structural Study of Fretting Contact Caused by the Difference of the Tin Plating Thickness. IEICE Trans. Electron. (8) (2008)