Sam Yang

Publication Activity (10 Years)

Years Active: 2005-2022
Publications (10 Years): 7

Top Topics

Mathematical Formulation

Top Venues

Adv. Eng. Softw.

Publications

José V. C. Vargas, Sam Yang, Juan Carlos Ordonez, Luiz F. Rigatti, Pedro H. R. Peixoto, Wellington Balmant, Andre B. Mariano
Electronic packaging cabinets simplified modeling, simulation, and experimental validation for systems engineering. Simul. 98 (8) (2022)
Peter Washington, Aayush Nandkeolyar, Sam Yang
MLPro: A System for Hosting Crowdsourced Machine Learning Challenges for Open-Ended Research Problems. CoRR (2022)
Sam Yang, Bjorn Vaagensmith, Deepika Patra, Ryan Hruska, Tyler Phillips
Multi-fidelity power flow solver. CoRR (2022)
Jingwen Fu, Xiaoyi Zhang, Yuwang Wang, Wenjun Zeng, Sam Yang, Grayson Hilliard
Understanding Mobile GUI: from Pixel-Words to Screen-Sentences. CoRR (2021)
Alvin L.-S. Loke, Da Yang, Tin Tin Wee, Jonathan L. Holland, Patrick Isakanian, Kern Rim, Sam Yang, Jacob S. Schneider, Giri Nallapati, Sreeker Dundigal, Hasnain Lakdawala, Behnam Amelifard, Chulkyu Lee, Betty McGovern, Paul S. Holdaway, Xiaohua Kong, Burton M. Leary
Analog/Mixed-Signal Design Challenges in 7-nm CMOS and Beyond. CICC (2019)
Alvin Leng Sun Loke, Da Yang, Tin Tin Wee, Jonathan L. Holland, Patrick Isakanian, Kern Rim, Sam Yang, Jacob S. Schneider, Giri Nallapati, Sreeker Dundigal, Hasnain Lakdawala, Behnam Amelifard, Chulkyu Lee, Betty McGovern, Paul S. Holdaway, Xiaohua Kong, Burton M. Leary
Analog/mixed-signal design challenges in 7-nm CMOS and beyond. CICC (2018)
Sam Yang, J. C. Ordonez, J. V. C. Vargas, Julie S. Chalfant, Chrys Chryssostomidis
Mathematical formulation and demonstration of a dynamic system-level ship thermal management tool. Adv. Eng. Softw. 100 (2016)
Sam Yang, Emerson Dilay, J. C. Ordonez, J. V. C. Vargas, Julie S. Chalfant
Volume element model mesh generation strategy and its application in ship thermal analysis. Adv. Eng. Softw. 90 (2015)
Jizu Huang, Liqun Cao, Sam Yang
A Molecular Dynamics-Continuum Coupled Model for Heat Transfer in Composite Materials. Multiscale Model. Simul. 10 (4) (2012)
Victor Chan, Ken Rim, Meikei Ieong, Sam Yang, Rajeev Malik, Young Way Teh, Min Yang, Qiqing Ouyang
Strain for CMOS performance improvement. CICC (2005)