Pin-Cheng Kuo

Publication Activity (10 Years)

Years Active: 2020-2023
Publications (10 Years): 5

Top Topics

Wireless Communication

Integrated Circuit

Top Venues

Publications

Tun-Yao Hung, Guan-Hong Chen, Yuan-Zeng Lin, Chi-Wai Chow, Yin-He Jian, Pin-Cheng Kuo, Ching-Wei Peng, Jui-Feng Tsai, Yang Liu, Chien-Hung Yeh
Wideband and Channel Switchable Mode Division Multiplexing (MDM) Optical Power Divider Supporting 7.682 Tbit/s for On-Chip Optical Interconnects. Sensors 23 (2) (2023)
Pin-Cheng Kuo, Chi-Wai Chow, Yuan-Zeng Lin, Wahyu Hendra Gunawan, Tun-Yao Hung, Yin-He Jian, Guan-Hong Chen, Ching-Wei Peng, Yang Liu, Chien-Hung Yeh
Design Consideration, Numerical and Experimental Analyses of Mode-Division-Multiplexed (MDM) Silicon Photonics Integrated Circuit with Sharp Bends. Sensors 23 (6) (2023)
Pin-Cheng Kuo, Sheng-I Kuo, Ju-Wei Wang, Yin-He Jian, Zohauddin Ahmad, Po-Han Fu, You-Chia Chang, Jin-Wei Shi, Ding-Wei Huang, Yang Liu, Chien-Hung Yeh, Chi-Wai Chow
Actively Steerable Integrated Optical Phased Array (OPA) for Optical Wireless Communication (OWC). OFC (2022)
Pin-Cheng Kuo, Yeyu Tong, Chi-Wai Chow, Jui-Feng Tsai, Yang Liu, You-Chia Chang, Chien-Hung Yeh, Hon-Ki Tsang
4.36 Tbit/s Silicon Chip-to-Chip Transmission via Few-Mode Fiber (FMF) using 2D Sub-wavelength Grating Couplers. OFC (2021)
Guan-Hong Chen, Jui-Feng Tsai, Ching-Wei Peng, Pin-Cheng Kuo, Chun-Jui Chen, Chi-Wai Chow, Chien-Hung Yeh, Yinchieh Lai, Yang Liu
Compact Mode Division MUX/DEMUX Using Enhanced Evanescent-Wave Coupling on Silicon-on-Insulator (SOI) Platform for 11-Tbit/s Broadband Transmission. IEEE Access 8 (2020)