Michael J. Degerstrom

Publication Activity (10 Years)

Years Active: 2001-2023
Publications (10 Years): 3

Publications

Michael J. Degerstrom, Chad M. Smutzer, Richard B. Ericson, Clifton R. Haider, Barry K. Gilbert
Plated-Through-Hole Via Design Specifications for 112G Serial Links. CoRR (2023)
Michael J. Degerstrom, Chad M. Smutzer, Barry K. Gilbert, Erik S. Daniel
56 Gbps PCB Design Strategies for Clean, Low-Skew Channels. CoRR (2023)
Michael J. Degerstrom, Chad M. Smutzer, Patrick J. Zabinski, Barry K. Gilbert
Inverting the SerDes Link Design Flow Process. CoRR (2023)
Barry K. Gilbert, Michael J. Degerstrom, Patrick J. Zabinski, Thimothy M. Schafer, Gregg J. Fokken, Barbara A. Randall, Daniel J. Schwab, Erik S. Daniel, Scott C. Sommerfeldt
Emerging multigigahertz digital and mixed-signal integrated circuits targeted for military applications: dependence on advanced electronic packaging to achieve full performance. Proc. IEEE 89 (4) (2001)